Press Releases

  StratEdge Displays High-Performance Semiconductor Packages at IMS 2022, June 21-23, in Booth 4089
  Getting a Reliable Signal: StratEdge's High-Performance Power Amplifier Packages
  StratEdge High-Power Semiconductor Packages will be Featured at CS MANTECH in Monterey, California
  StratEdge to Display Post-fired, Molded Ceramic, and Ceramic QFN Semiconductor Packages at the IMAPS Device Packaging, APEC 2022, and GOMACTech Conferences
  StratEdge to Present Glass Sidewall for Power Semiconductors and Ceramic Packages for 5G at IMAPS 2021 Live
  StratEdge High-performance Semiconductor Packages to be on Display at IMS2021, June 8-9, in Booth 1014
  StratEdge SMK Surface Mount Packages Support DC to 26 GHz Devices
  StratEdge Announces Increased Manufacturing Capacity of Small Outline Glass Sidewall Thermally Enhanced Packages for Power Semiconductors
  Getting a Good Signal: StratEdge’s High-Performance Power Amplifier Packages on the Red Planet
  StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
  StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020
  StratEdge Reports A Strong Third Quarter
  StratEdge White Paper, "Eutectic Die Attach Optimizes High Power GaN Devices," is Now Available
  StratEdge Expands Production Capacity of its RF Packaging Line
  COVID-19 Coronavirus Update: StratEdge is open for business.
  StratEdge Features its High-frequency, High-power Semiconductor Packages and Assembly Services at Three Trade Shows in March
  StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
  StratEdge Expands Packaging and Assembly Services for High-Frequency and High-Power Devices
  StratEdge High-Frequency and High-Power Packages and Assembly Services to be Featured at IMAPS and European Microwave Week 2019 Events
  StratEdge President and CEO Tim Going Selected as a Finalist for the 2019 CEO of the Year Award
  StratEdge High-performance Semiconductor Packages to be on Display at IMS2019, June 4-6, in Booth 361
  StratEdge High-frequency, Thermally-efficient Packages for Compound Semiconductors to be Featured at CS ManTech
  StratEdge to Display Post-fired, Molded Ceramic, and Ceramic QFN Semiconductor Packages at the IMAPS Device Packaging, APEC 2019, and GOMACTech Conferences
  StratEdge Selects Casey Krawiec as Vice President of Global Sales
  StratEdge to Display GaN and GaAs Packages at IMAPS, BCICTS, and EDI CON USA
  StratEdge Receives ISO 9001:2015 Quality Management Systems Certification
  StratEdge Features Packages for the Extreme Demands of GaN and GaAs Devices at IMS2018 in Booth 1649
  StratEdge to Display High-Temperature and High-Reliability Packages at CS ManTech and IMAPS HiTEC Conferences
  StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
  Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
  StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
  Marty Daniel Joins StratEdge as Account Manager
  StratEdge Introduces New, Mobile-Friendly Website
  StratEdge Expands CMC Base Laminate Packages to Include High-Power GaN Transistors & MMIC Devices
  StratEdge Semiconductor Packages Now Sold on
  StratEdge Introduces High-frequency Surface Mount Package
  StratEdge Introduces Low-profile, High-power Switch Package
  StratEdge Introduces Family of X-Band High Power Amplifiers in Surface Mount Packages
  StratEdge Unveils Series of Small Outline Thermally Enhanced Packages for Power Semiconductors
  StratEdge Announces Success of Employee Vanpool Transportation Program
  StratEdge Moves to New San Diego Facilities
  StratEdge SMT Molded Ceramic Packages Support Frequencies of DC to 20 GHz
  StratEdge Announces New Package Line to Support Power Applications
  StratEdge SMX Surface Mount Packages Support DC to 18GHz Devices
  StratEdge Power Amplifier Package Used on Mars Rovers
  StratEdge Introduces Low Cost Hermetic Semiconductor Packages for Switch Applications
  Casey Krawiec Promoted to StratEdge VP North American Sales
  StratEdge, J microTechnology, and Accel-RF Host MMIC Packaging, Testing and Reliability Seminar at MTT-S
  StratEdge High Frequency Package Chosen for Device Life Testing in Accel-RF Equipment