Press Releases

In focus

Product technologySeptember 22, 2026

Molded ceramic packages for MIL-STD applications

More than 200 standard outlines and thermally enhanced base options support demanding applications, with selected MC Series configurations operating up to 18 GHz.

The release archive

Explore company announcements, product news, and industry milestones by year.

81 releases in the archive

20267 releases

September 22, 2026
StratEdge to Showcase Versatile Molded Ceramic Packages for MIL-STD Applications at IMAPS and BCICTS
August 27, 2026
StratEdge Opens New Facility in Poway
July 1, 2026
StratEdge Gold Plated Tabs for High-Power Semiconductors
May 15, 2026
StratEdge Takes High-Reliability Packaging on the Road for CSMantech, Space Tech Expo USA, and IMS 2026
May 1, 2026
StratEdge Honored with a Partner 2 Win Gold Tier Award from BAE Systems
April 7, 2026
StratEdge Brings Gold Plated Tab and Packaging Expertise to CMSE 2026
February 26, 2026
StratEdge Powers Up for 2026: Showcasing Molded Ceramic Packages at IMAPS Device Packaging and GOMACTech

20257 releases

November 12, 2025
StratEdge Celebrates IMAPS Awards for President Tim Going and VP Casey Krawiec Japanese translation, opens in a new tab
September 23, 2025
StratEdge Highlights High-Performance Packaging at IMAPS and BCICTS
June 12, 2025
StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336
May 6, 2025
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
April 10, 2025
From Extreme Heat to Orbit: StratEdge Displays RF and High-Power Solutions at iMAPS HiTEC and CMSE
February 25, 2025
StratEdge Power Up for 2025: Showcasing the Latest Molded Ceramic Packages at IMAPS Device Packaging and GOMACTech Conferences
January 21, 2025
StratEdge Corporation Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York

20249 releases

November 21, 2024
StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award
October 31, 2024
Coastal RF Systems Joins StratEdge's Network as Manufacturer's Representative for Southern California
October 17, 2024
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
September 10, 2024
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
August 13, 2024
StratEdge Brings Gold Medal Performance with its Molded Ceramic and Post-fired Ceramic Packages, and High-reliability Assembly Services
June 13, 2024
StratEdge High-Performance Semiconductor Packages to be on Display at IMS 2024 Booth 515
April 29, 2024
StratEdge Takes High-Frequency Packaging Technology to New Heights at Upcoming Events
March 7, 2024
StratEdge Brings Packaging Innovation to IMAPS Device Packaging
February 15, 2024
No Redesign Required: StratEdge Revives Critical Hybrid Packages

20236 releases

20227 releases

20215 releases

20206 releases

November 18, 2020
StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
October 5, 2020
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020
September 21, 2020
StratEdge Reports A Strong Third Quarter
August 6, 2020
StratEdge White Paper, "Eutectic Die Attach Optimizes High Power GaN Devices," is Now Available
June 6, 2020
StratEdge Expands Production Capacity of its RF Packaging Line
March 20, 2020
COVID-19 Coronavirus Update: StratEdge is open for business.

Earlier releases34 releases

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In focus

Molded ceramic packages for MIL-STD applications

More from StratEdge

Gold plated tabs for high-power semiconductors

High-reliability packaging on the road

Die-on-tab and packaging expertise at CMSE

Packaging solutions at IMAPS and GOMACTech

IMAPS recognizes StratEdge leadership

Four decades of high-performance packaging

The release archive

Stay connected to StratEdge.