![Events Events](img/stratedge-at-imaps-hitec-cs-mantec-300.png)
Events
Visit StratEdge at these events to see the latest packaging technology for high-temperature applications, including Si, GaAs, and GaN devices. StratEdge packages have been popular for their heat dissipating properties and high-reliability for over 20 years. With a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are truly critical. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips.
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Space Tech Expo May 13-15, 2024 Long Beach, CA Booth 5027 |
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IEEE - IMS June 18-20, 2024 Washington DC Booth 515 |