Events
Visit StratEdge at these events to see the latest packaging technology for high-temperature applications, including Si, GaAs, and GaN devices. StratEdge packages have been popular for their heat dissipating properties and high-reliability for over 40 years. With a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are truly critical. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips.
| Show | Location | Booth | Exhibition Dates |
| iMAPS DPC (Device Packaging Conference) | Phoenix, AZ | 110 | March 3-5 |
| GOMACTech (Government Microcircuit Applications & Critical Technology Conference) | New Orleans, LA | 520 | March 10-11 |
| CMSE (Components for Military & Space Electronics) | Los Angeles, CA | Main hall | April 29-30 |
| CS Mantech | Portland, OR | 418 | May 18-20 |
| Space Tech Expo USA | Long Beach, CA | 323 | June 2-4 |
| IEEE- IMS (International Microwave Symposium) | Boston, MA | 23060 | June 9-11 |
| iMAPS Symposium | Everett, MA | TBD | Sept 29-30 |
| EuMW (European Microwave Week) | Excel, London | TBD | Oct 6-8 |
| BCICTS (IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium) | Scottdale, AZ | TBD | October 12-14 |