Visit StratEdge at these events to see the latest packaging technology for high-temperature applications, including Si, GaAs, and GaN devices. StratEdge packages have been popular for their heat dissipating properties and high-reliability for over 20 years. With a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are truly critical. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips.
April 30-May 1, 2019 - Hyatt Regency, Minneapolis, MN
MiNaPAD Forum (Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing)
May 22-23, 2019 - Grenoble, France
IMS International Microwave Symposium
June 2-7, 2019 - Boston, Massachusetts